Description
Product Description: Breadboard 830 is a solderless (plug-in) breadboard with 830 connection tie-points (i.e. 830 wire insertion holes). It has 4 power rails. Solderless breadboard are great for building and testing new circuits because parts can be easily inserted and removed. They are completely re-usable. The BB830 has a 630 tie-point IC-circuit area plus four 50 tie-point power rails. The housing is made of white ABS plastic, with a printed legend giving numbers and letters for columns and rows. The internal contacts are phosphor bronze with a plated nickel finish. A peelable adhesive tape backing is provided for attaching it to a surface and an optional metal back plate is provided. Nr. Sockets: 830 Level : 0 ~ 60 Vertical Sequence: A ~ J Socket Pitch : 2.54mm Contact Type: Double leaf copper spring Board Material : ABS Polymer Board Base: Adhesive Size: Approx.165x55x9mm
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